Integrated circuit packaging

Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing.

In the integrated circuit industry it is called simply packaging and sometimes semiconductor device assembly, or simply assembly. Also, sometimes it is called encapsulation, by the name of its last step.

The following operations are performed at this stage.

• Die attaching
• IC Bonding
  • Wire bonding
  • Flip chip
  • Tab bonding
• IC encapsulation